| Xtel® XK2040 compounds are high performance, glass fiber reinforced, PPS based alloys developed to provide excellent mechanical strength and electrical properties along with excellent flow in thin-walled parts, low flash characteristics, and fast cycle times. Xtel® XK2040 compounds can be easily molded in conventional injection molding equipment utilizing water heated molds. |
|
| NOMINAL ENGINEERING PROPERTIES(1) |
Value |
Test Method |
| Tensile Strength, Ksi |
25.0 |
ASTM D638 |
| Elongation, % |
1.6 |
ASTM D638 |
| Flexural Strength, Ksi |
32.0 |
ASTM D790 |
| Flexural Modulus, Msi |
1.9 |
ASTM D790 |
| Notched Izod Impact, ft·lb/in, 1/8 in specimen |
1.6 |
ASTM D256 |
| Unnotched Izod Impact, ft·lb/in, 1/8 in specimen |
10.0 |
ASTM D256 |
| Compressive Strength, Ksi |
35.0 |
ASTM D695 |
| Heat Deflection Temperature, 264 psi,°F |
465 |
ASTM D648 |
| Coefficient of Linear Thermal Exp., X 10-6 in/in/°C |
  |
ASTM E831 |
| Axial Direction, -50°C to 50°C |
20 |
|
| Axial Direction, 100°C to 200°C |
15 |
|
| Transverse Direction, -50°C to 50°C |
55 |
|
| Transverse Direction, 100°C to 200°C |
90 |
|
| Flammability Rating |
V-0 |
UL 94 |
| Dielectric Strength, V/mil |
550 |
ASTM D149 |
| Dielectric Constant, 78° F |
|
ASTM D150 |
| 1kHz |
4.0 |
  |
| 1MHz |
3.8 |
  |
| Dissipation Factor, 78°F |
|
ASTM D150 |
| 1 kHz |
0.020 |
|
| 1 MHz |
0.010 |
|
| Volume Resistivity, ohm·cm |
1 x 1013 |
ASTM D257 |
| Arc Resistance, sec |
100 |
ASTM D495 |
| Comparative Tracking Index, V |
250 |
UL 746A |
| Insulation Resistance, ohm (90°C, 95% RH, 48 hr) |
1 x 1010 |
|
| Mold Shrinkage(2) in/in, Flow/Transverse |
0.003 / 0.005 |
  |
| Density, g/cc |
1.65 |
ASTM D792 |
| Water Absorption, % |
0.20 |
ASTM D570 |
| Color |
Natural |
  |
|
| (1) Test specimen molding conditions; Stock Temperature, 540-580° F; Mold Temperature 210° F |
| (2) Measured on 4 in X 4 in X 1/8 in Plaques, Edge Gated |
| The nominal properties reported herein are typical of the product but do not reflect normal testing variances and therefore should not be used for specification purposes. |
| Xtel® XK2040 compounds are high performance, glass fiber reinforced, PPS based alloys developed to provide excellent mechanical strength and electrical properties along with excellent flow in thin-walled parts, low flash characteristics, and fast cycle times. Xtel® XK2040 compounds can be easily molded in conventional injection molding equipment utilizing water heated molds. |
|
| NOMINAL ENGINEERING PROPERTIES(5) |
Value |
Test Method |
| Tensile Strength, MPa |
180 |
ISO 527 |
| Elongation, % |
1.7 |
ISO 527 |
| Flexural Strength, MPa |
250 |
ISO 178 |
| Flexural Modulus, GPa |
12 |
ISO 178 |
| Notched Izod Impact, kJ/m2 |
8.0 |
ISO 180A |
| Unnotched Izod Impact, kJ/m2 |
30 |
ISO 180A |
| Compressive Strength, MPa |
240 |
ISO 604 |
| Heat Deflection Temperature, 1.8 MPa,°C |
240 |
ISO 75 |
| Coefficient of Linear Thermal Exp., X 10-6 in/in/°C |
  |
ISO 11359-2 |
| Axial Direction, -50°C to 50°C |
20 |
|
| Axial Direction, 100°C to 200°C |
15 |
|
| Transverse Direction, -50°C to 50°C |
55 |
|
| Transverse Direction, 100°C to 200°C |
90 |
  |
| Flammability Rating |
V-0 |
UL 94 |
| Dielectric Strength, kV/mm |
22 |
ASTM D149 |
| Dielectric Constant, 25°C |
|
ASTM D150 |
| 1kHz |
4.0 |
|
| 1MHz |
3.8 |
|
| Dissipation Factor, 25°C |
  |
ASTM D150 |
| 1 kHz |
0.020 |
|
| 1 MHz |
0.010 |
|
| Volume Resistivity, ohm·cm |
1 x 1013 |
ASTM D257 |
| Arc Resistance, sec |
100 |
ASTM D495 |
| Comparative Tracking Index, V |
250 |
UL 746A |
| Insulation Resistance, ohm (90°C, 95% RH, 48 hr) |
1 x 1010 |
|
| Mold Shrinkage(6) m/m, Flow/Transverse |
0.003 / 0.005 |
  |
| Density, g/cc |
1.65 |
ISO 1183A |
| Water Absorption, % |
0.20 |
ASTM D570 |
| Color |
Natural |
|
|
| (5) Test specimen molding conditions; Stock Temperature, 280-305° C; Mold Temperature 100° C |
| (6) Measured on 102 mm X 102 mm X 3.2 mm Plaques, Edge Gated |
| The nominal properties reported herein are typical of the product but do not reflect normal testing variances and therefore should not be used for specification purposes. |
|
|